Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Auto, Motorcycle Parts & Accessories, Industrial Equipment & Components, Manufacturing & ...
Type of Ownership:
Limited Company
Management System Certification:
ISO 9001
Main Markets:
Europe, Southeast Asia/ Mideast, Domestic
OEM/ODM Service
Sample Available
Japanese Speaker

Mould, Stamping, Precision Stamping manufacturer / supplier in China, offering Precision Components for IC Encapsulation Stamping, Aluminium/ Zinc Die Casting Mold, Anodized and Screw Threaded Tooling, Custom-Made Stamping Mould, High Precision Stamping Die, Rd30/Rd50 and so on.

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Precision Components for IC Encapsulation Stamping

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Min. Order / Reference FOB Price
1 Piece US $30/ Piece
Port: Shenzhen, China
Production Capacity: 1000PCS Per Month
Payment Terms: T/T
Type: Cold Stamping
Processing Type: Shaping Metal
Material: Tungsten Carbide
Mould: Multistep Progressive Dies
Surface Processing: Hip
Fine Blanking: Open

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Basic Info

Model NO.: HY127
Process: Forming Process
Industry: Metal Stamping Parts
Tolerances: 0.002mm
Customized: Customized
Name: Punch
Processing: Profile Grinding(Pg)
Size: 10mm*12mm*50mm
Tolerance: 0.002mm
Cutting Length: 15mm
Transport Package: Foam
Specification: 10mm*12mm*50mm
Origin: Dong Guan
HS Code: 8207300090

Product Description

The cutting length area with mirror surface, the surface roughness is around Ra0.03, tolearnce can be controlled in ±0.002mm. Grind cutting area only, without any hand polishing.

Special Introductions:
 
Material:RD30(Carbide)
Processing Machine:Surface grinder, Profile Grinder
Outside contour Tol.:±0.001mm
Profile Tol.:±0.002mm
Measuring instruments:Projector, Toolmaker Microscope
Design:non-standard parts, according to customer's request
Quotation:We will quote in tow hours once we receive inquiries
Delivery Time:2days
Packing:Carton, attached Quality Control report 

Precision Components for IC Encapsulation Stamping
Precision Components for IC Encapsulation Stamping
Precision Components for IC Encapsulation Stamping
Precision Components for IC Encapsulation Stamping



Environments:

1.Processing Environment:

Whole production department with stable temperature around 21ºC to keep the accuracy of  machines.




2.QC Environment:

Whole QC department keep the same temperature 21ºC to make sure the parts in shape.

Materials:

We import various kinds of grade carbide to meet worldwide customers' demand.:




Application fields of carbide:
 
Ultrafine grades: grain size 0.2-0.5um, thanks to their high transverse rupture strength these grades are particularly suitable for stamping thin sheet metal and foils with extremely thin-walled punches.
 
Submicron grades: grain size 0.5-0.8um, For difficult abrasive materials and wherever there is a tendency for galling; Excellent wear resistance;
 
Fine/Medium grades: grain size 1.3-2.5um, the standard grades for blanking and stamping tools; Ideal compromise between wear resistance and tracture toughness with very good edge stability.



If you want to know more, please contact us.

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