Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Auto, Motorcycle Parts & Accessories, Industrial Equipment & Components, Manufacturing & ...
Type of Ownership:
Limited Company
Management System Certification:
ISO 9001
Main Markets:
Europe, Southeast Asia/ Mideast, Domestic
OEM/ODM Service
Sample Available
Japanese Speaker

Mould, Stamping, Precision Stamping manufacturer / supplier in China, offering Precision Punches for IC Encapsulation Stamping, Aluminium/ Zinc Die Casting Mold, Anodized and Screw Threaded Tooling, Custom-Made Stamping Mould, High Precision Stamping Die, Rd30/Rd50 and so on.

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Supplier Homepage Products Punch & Die Precision Punches for IC Encapsulation Stamping

Precision Punches for IC Encapsulation Stamping

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Min. Order / Reference FOB Price
1 Piece US $30/ Piece
Port: Hong Kong, Hong Kong
Production Capacity: 1000PCS Per Month
Payment Terms: T/T
Type: Progressive Die
Processing Type: Shaping Metal
Material: Tungsten Carbide
Mould: Multistep Progressive Dies
Surface Processing: Hip
Fine Blanking: Progressive Die

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Basic Info

Model NO.: HY166
Process: Forming Process
Industry: Metal Stamping Parts
Tolerances: 0.002mm
Customized: Customized
Name: Punch
Processing: Profile Grinding(Pg)
Size: 10mm*12mm*50mm
Tolerance: 0.002mm
Cutting Length: 15mm
Transport Package: Foam
Specification: 10mm*12mm*50mm
Origin: Dong Guan
HS Code: 8207300090

Product Description

Hong Yu specializes in manufacturing of Customized stamping die components, injection mold components, die casting mold components, precision metal parts, etc.

Product Introduction:
Customized mold parts. 
 
  1. Reliable materials from prominent / well-known manufacturers such as ASSAB, Seratizit, Sumitomo, Sanalloy, Everloy, Kennametal, CB Carbide, YT Carbide, Gröditz, Daido, Hitachi, etc. 
  2. Advanced equipments such as Waida PG from Japan, Charmilles WEDM from Switzerland, Sodick WEDM from Japan, Mitsubizi WEDM from Japan, Nikon Tool Microscope from Japan, Nikon Dig Micro Altimeter from Japan, Accretech Contourcord from Switzerland, Mahr projector.
  3. State-of-the-art technology.
  4. Excellent and reliable quality.
  5. Perfect quality controlled system.
  6. Intime delivery.
  7. Satisfying after sales-service. 
  8. Reasonable and competitive price.
  1. Precision Punches for IC Encapsulation StampingPrecision Punches for IC Encapsulation Stamping
Production Environments:

1.Processing Environment:

Whole production department with stable temperature around 21ºC to keep the accuracy of  machines.




2.QC Environment:

Whole QC department keep the same temperature 21ºC to make sure the parts in shape.

Materials:

We import various kinds of grade carbide to meet worldwide customers' demand.:




Application fields of carbide:
 
Ultrafine grades: grain size 0.2-0.5um, thanks to their high transverse rupture strength these grades are particularly suitable for stamping thin sheet metal and foils with extremely thin-walled punches.
 
Submicron grades: grain size 0.5-0.8um, For difficult abrasive materials and wherever there is a tendency for galling; Excellent wear resistance;
 
Fine/Medium grades: grain size 1.3-2.5um, the standard grades for blanking and stamping tools; Ideal compromise between wear resistance and tracture toughness with very good edge stability.



Other information:

1, Custom-made orders. Independent Q.C department. Strick and scientific quality control system.
2, 100% inspectioned before shipping
3, ISO9001:2015 certified.
 
Packaging
sponge - pp bags - hard boxes - foam - master cartons.
Precision Punches for IC Encapsulation Stamping
Pleae do contact us without any hesitation for any questions. Your inquiries will be highly appreciated.
Welcome to visit our factory. 
Phil 
market1(dot)dghongyumold(dot)com

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